New COMs from congatec fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards.
SIMCom launched new compact, smart AI modules that give engineers a head start in designing imaging AI applications.
A new job posting from SpaceX mentions the company wants to develop compact 'multi-chip modules' to handle radio frequencies ...
End-to-end internet of things (IoT) solutions enabler Telit Cinterion has launched its FE990D50 and FE990D60 series. The next ...
RF components growth in aerospace/defense, 2023 gains vs margin pressure, fair valuation, strong balance sheet—read now.
Although we can already buy commercial transceiver solutions that allow us to use PCIe devices like GPUs outside of a PC, ...
Abstract: The design of power module requires an accurate multi-physical fields simulation methodology to simulate the electro-thermal stress accurately. The paper proposed an automated multi-physical ...
Not everyone hates the Canon RF 70-200mm f/2.8 – but certainly when it was first introduced, it came in for lots of criticism. More often than not, when I'm using this lens or it comes up in ...
Abstract: This tutorial presents an overview of RF and mm-wave power-amplifier (PA) designs in silicon, focusing on the design fundamentals. First, the tutorial introduces PA performance metrics and ...
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